• 2026 ABB Entrepreneurship Challenge (China) Concludes Successfully
    2026 ABB Entrepreneurship Challenge (China) Concludes Successfully
    ABB, in collaboration with its open innovation platform SynerLeap, has announced Beijing Wansheng Intelligent Technology Co., Ltd. (“Wansheng Intelligent”) as the winner of the 2026 ABB Startup Challenge (China). The company’s winning entry leverages AI to make automation engineering faster, simpler, and more user-friendly. This year marks the seventh edition of the competition and its inaugural launch in China. ABB experts will collaborate with Wansheng Intelligent to jointly develop market-ready solutions, with plans to subsequently promote their adoption among ABB’s customers and partners. The winning company will receive a project grant of RMB 200,000 and gain support from SynerLeap to help foster its growth and enhance its visibility.
    - Nov 02, 2026
  • Nangang Signs Strategic Framework Agreement with China Instrument and Control Society
    Nangang Signs Strategic Framework Agreement with China Instrument and Control Society
    On October 27, a signing ceremony for a strategic cooperation framework agreement between Nanjing Iron & Steel (NISCO) and the China Instrument and Control Society (CIS), combined with a meeting on promoting industrial chain synergy, was held. Attendees included Miao Changxing, Party Branch Secretary and Vice President of the China Instrument and Control Society, along with Secretary-General Cheng Hong and Deputy Secretary-General Lei Xiaoyi. Also present were representatives from various enterprises—including Beijing Jingyi Group, Beijing Const Instruments, HollySys, NCS Testing Technology, Chongqing Chuanyi, and Anhui Tiankang—as well as NISCO leadership, including Party Secretary and Chairman Huang Yixin, Executive Vice President Xu Xiaochun, and Vice President Wang Runze. At the meeting, the Manufacturing Department of Nanjing Iron & Steel (NISCO) delivered a presentation titled "Advancing Strategic Cooperation." Representatives from various enterprises engaged in discussions centered on topics such as localization, joint technological innovation, and industrial chain synergy. Participants expressed a shared commitment to deepening cooperation and fostering a collaborative ecosystem with NISCO—focusing on areas like intelligent upgrades, sensing and control, technological innovation, and on-site problem-solving—with the goal of integrating more homegrown instrumentation solutions directly into steel production lines.
    - Nov 02, 2026
  • Axera makes an appearance at the CIIF, officially launching the AX8860 series of high-compute edge AI chips.
    Axera makes an appearance at the CIIF, officially launching the AX8860 series of high-compute edge AI chips.
    Leading AI chip company Axera made a high-profile appearance at CIIF 2026 (China International Industry Fair) under the theme "Intelligent Manufacturing Without Boundaries, Computing Power Within Reach." The company showcased its comprehensive AI computing foundation and product portfolio designed for the physical world, while officially launching the AX8860—a new series of high-performance AI chips. Engineered specifically to facilitate the deployment of large-scale models at the edge and on-device, the AX8860 series marks a pivotal shift for edge AI: moving beyond the phase of technical validation into a new era focused on delivering tangible, business-driven productivity. At this year’s China International Industry Fair (CIIF), Axera has organized its exhibition into four key areas—Core Computing Power & Technical Foundations, Industry Solutions, Software Architecture & Toolchains, and Ecosystem & Value Co-creation—collectively showcasing a comprehensive suite of computing solutions for "Physical AI." Centered around the AX8860, the company presents a diverse product portfolio—ranging from chips and core modules to inference cards and servers—that provides robust support for intelligent manufacturing, spanning everything from foundational computing power to end-to-end application deployment.
    - Oct 19, 2026
  • Huayan Embodied AI Motion Base: Building a Universal Physical Foundation for Robots in the Era of Embodied AI
    Huayan Embodied AI Motion Base: Building a Universal Physical Foundation for Robots in the Era of Embodied AI
    On the first day of the China International Industry Fair (CIIF), Mr. Wang Guangneng, Chairman of the Board and General Manager of Huayan Robotics, officially unveiled an "embodied intelligence motion base." This is a standardized, modular, and open "universal physical foundation for embodied robots"—a solution developed by Huayan Robotics for partners in the field of embodied intelligence. It distills over 20 years of Huayan’s technical R&D, product iteration, and real-world deployment experience into reusable capabilities, accelerating the transition of embodied intelligence into practical industrial applications.
    - Oct 19, 2026
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A total of 51 pages

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