PCI-6122 National Instruments

PCI-6122 National Instruments Multi-Function Processor Module

Product  Description：

National Instruments (NI) Multi-Function Processor Modules, primarily utilized within high-performance PXI, PXI Express, and CompactRIO platforms, are advanced embedded hardware units designed to execute complex, real-time computational tasks. These modules combine powerful multi-core processing architectures with user-programmable Field Programmable Gate Arrays (FPGAs). This dual-layer architecture allows them to handle high-speed data acquisition, deterministic closed-loop control, and intensive signal processing simultaneously, bypassing the latency constraints of traditional PC-based control systems.

Product Parameters

The technical foundation of an NI Multi-Function Processor Module is centered on hardware-level execution speed, high throughput, and flexible memory utilization:

• Processor Architecture: Features multi-core Intel Atom, Core i7, or ARM-based real-time processors combined with high-density Xilinx Kintex or Zynq FPGAs.

• Operating System Support: Runs deterministic real-time operating systems such as NI Linux Real-Time, ensuring microsecond-level execution reliability.

• Onboard Memory: Equipped with high-capacity DDR3 or DDR4 RAM for data buffering alongside non-volatile Flash memory for standalone program storage.

• System Throughput: Designed for PXI Express or CompactRIO backplane buses, supporting high-bandwidth data transfer rates up to several gigabytes per second.

• Synchronicity and Timing: Integrated with internal timing and synchronization chips capable of sub-nanosecond clock sharing across multiple modules.

• Power Architecture: Draws efficient DC power directly from the chassis backplane, with internal power management optimized to handle fluctuating processing loads.

Product Advantages

NI Multi-Function Processor Modules provide unique performance capabilities for advanced test, measurement, and control applications:

• Heterogeneous Computing: The combination of a real-time processor and an FPGA allows developers to offload time-critical, high-speed tasks to hardware while running decision-making logic on the CPU.

• Microsecond Closed-Loop Latency: Hardware-level processing enables ultra-fast control loops, making it possible to sample data, process algorithms, and generate outputs in less than a microsecond.

• Native LabVIEW Integration: Fully programmable via the LabVIEW development environment, including the LabVIEW Real-Time and LabVIEW FPGA modules, eliminating the need for complex VHDL code.

• Software-Defined Flexibility: The underlying hardware functions can be completely reconfigured via software updates, allowing the same physical module to perform entirely different tasks as project requirements change.

• Ruggedized Industrial Build: CompactRIO variants feature high shock and vibration resistance, capable of operating in extreme temperatures ranging from -40°C to 70°C.

Product Applications

These processing modules are deployed in highly specialized environments requiring real-time mathematical computations and high-speed I/O:

• Hardware-in-the-Loop Simulation: Simulating real-time physical environments, such as electric vehicle powertrains or aircraft flight dynamics, to test electronic control units (ECUs).

• Advanced Robotics and Autonomous Systems: Executing complex kinematics, sensor fusion algorithms, and trajectory planning for unmanned vehicles and robotic assemblies.

• Smart Grid and Power Quality Analysis: Processing high-frequency electrical waveforms on electrical grids to detect transient faults, harmonics, and phase discrepancies instantly.

• Medical Device Prototyping: Controlling high-precision laser diagnostic tools, ultrasound imaging processors, and complex life-support automation loops.

• Structural Health Monitoring: Aggregating and analyzing high-speed vibration data from strain gages and accelerometers on bridges, wind turbines, and aircraft wings.

Important Precautions

To maintain computational precision and protect the module from hardware damage, the following operational constraints must be observed:

• Thermal Management: Due to the high processing density of the CPU and FPGA, adequate chassis cooling is mandatory. Ensure the PXI or CompactRIO fan filters are clean and that specified slot clearances are maintained.

• FPGA Compilation Timing: When designing custom FPGA code, ensure that the compilation complies with the hardware clock constraints. Failing to meet timing constraints can result in unpredictable behavior or corrupted data.

• Backplane Power Constraints: Verify that the total power consumption of the processor module and adjacent I/O cards does not exceed the maximum wattage output of the chassis power supply.

• Data Loss Prevention: Always implement safe shutdown routines within the real-time software. Abruptly disconnecting power while the processor is writing to the non-volatile flash memory can corrupt the file system.

• Electrostatic Discharge Protection: Sensitive semiconductor traces on the module are highly vulnerable to static electricity. Always handle the module by its plastic bezel and use a grounded ESD wrist strap during installation or removal from the chassis.

The structure and details of the product：

Our services：

Shipping Port:  China

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Warranty: one year

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