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The 2026 Dazhihui Global Intelligent Manufacturing Summit, themed "Embodied Evolution: Intelligently Leading the Future," was successfully held in Suzhou. This summit focused on the critical bottlenecks facing embodied intelligence as it transitions from laboratory R&D to large-scale industrial deployment. It brought together leading experts from the fields of intelligent manufacturing, industrial communications, core semiconductor chips, intelligent robotics, as well as universities and research institutions. The CC-Link Partner Association (CLPA)—a pivotal global organization for establishing industrial network standards—made a prominent appearance at the event. Mr. Xu Jun, Director of the Association's China Office, attended the conference to deliver a keynote address; he also participated in a high-level roundtable discussion, fostering a deep industry consensus across the sectors of industry, academia, research, and application.

During the summit, Director Xu Jun noted in his address that embodied AI is emerging as the core engine driving the integrated development of next-generation artificial intelligence and intelligent manufacturing. He emphasized that deterministic communication networks—characterized by high stability, low latency, high reliability, and microsecond-level synchronization capabilities—serve as the critical foundation for ensuring the efficient, closed-loop coordination of "perception, decision-making, and execution" within embodied AI systems; indeed, they are widely recognized within the industry as the "neural network hub" for embodied AI. Built upon the international IEEE TSN standards, CC-Link IE TSN delivers full-stack technical capabilities encompassing Industrial Ethernet, TSN, and deterministic scheduling. It boasts five core advantages: microsecond-level synchronization, low-latency transmission, unified networking for control, information, and AI data, high reliability with ease of maintenance, and flexible scalability. As such, it stands as a mature commercial solution ideally suited for a comprehensive range of embodied AI applications. The CC-Link Association is committed to maintaining an open ecosystem for its standards, collaborating with chip manufacturers, solution providers, equipment manufacturers, and academic research institutions to comprehensively advance the full-stack localization and practical engineering deployment of these technologies, thereby constructing a unified, open, and secure communication foundation for the embodied AI industry.